The general development trend of surface mount technology is that the components are smaller and smaller, the installation density is higher and higher, and the installation is more and more difficult. In recent years, SMT has entered a new development climax. In order to adapt to the development of electronic products in the direction of short, small, light and thin, a variety of new packaged SMT components have emerged, which has triggered changes in production equipment, welding materials, mounting and welding processes, and promoted the manufacturing technology of electronic products to a new stage.

At present, SMT is making new technical progress in the following four aspects:

(1) Further miniaturization of component volume

Among the micro electronic complete machine products in mass production, 0201 series components (overall dimension 0.6mm * 0.3mm), QFP or BGA, CSP and FC with narrow lead spacing of 0.3mmIntegrated circuitIt has been widely adopted. Due to the further miniaturization of component volume, higher precision and stability are required for SMT surface assembly process level, SMT equipment positioning system, etc.

(2) Further improve the reliability of SMT products

In the face of the massive adoption of micro and small SMT components and the application of lead-free welding technology, under the extreme operating temperature and harsh environmental conditions, it is necessary to eliminate the stress produced due to the mismatch of the linear expansion coefficient of component materials, so as to prevent such stress from causing circuit board cracking or internal wire breakage, and component welding damage.

(3) Development of new production equipment

In the mass production process of SMT electronic products, solder paste printing machine, patch and reflow soldering equipment (solder paste thickness tester, furnace temperature tester) are indispensable. In recent years, all kinds of production equipment are developing towards high density, high speed, high precision and multi-function. High resolution laser positioning, optical visual identification system, intelligent quality control and other advanced technologies have been promoted and applied.

(4) FlexibilityPCBSurface mount technology based on matlab

With the wide application of flexible PCB in electronic product assembly, the installation of SMC components on flexible PCB has been overcome by the industry. The difficulty lies in how to practice the accurate positioning requirements of rigid fixation for flexible PCB

The general development trend of surface mount technology is that the components are smaller and smaller, the installation density is higher and higher, and the installation is more and more difficult. In recent years, SMT has entered a new development climax. In order to adapt to the development of electronic products in the direction of short, small, light and thin, a variety of new packaged SMT components have emerged, which has triggered changes in production equipment, welding materials, mounting and welding processes, and promoted the manufacturing technology of electronic products to a new stage.