Industry 4.0 is just a Chinese dream for the time being. That's because the delegates at the meeting have a clear definition and understanding of Industry 4.0: most of China's electronic manufacturing industry is in the stage of automation transformation, and very few enterprises have risen to the information level, while the intelligence representing the closed-loop system represents the essence of Industry 4.0. It can be seen that the first step is to realize the automation of SMT Electronics Factory!
SMT production equipment and SMT testing equipment
1. Three major pieces of SMT chip welding core production (necessary):
Printer full-automatic solder paste printer Mounter SMT Reflow reflow
Full automatic solder paste printer is critical:
1. Solder paste printing machine is critical to quality: SMT=Printer Mounter Reflow, more than 60% of defects in the whole production line are caused by solder paste printing:
2. Solder paste printing is critical to efficiency:
SMT=Printer Mounter Reflow, the bottleneck of SMT in mass production mainly comes from Printer; In order to reduce labor costs and pursue personal output value: mass production Mount popularizes the production rhythm of dual track and single patched PCB. When CT=10Sec, the proportion of dual track PCB in and out time is close to 0, the auxiliary waste is 0, and personal output is maximized; It is required that the Printer CoreCT10Sec is less than or equal to dual rails.
The SMT mounter is the most critical equipment of SMT production line with the highest requirements for technology and stability. It is a high-tech and precision equipment integrating mechanical, electrical, optical and other disciplines; In the modern SMT processing and manufacturing industry, the requirements for production safety and accuracy are high, and the equipment operation cycle is long (7X24H). It often requires high-speed, stable and high-precision operation 24 hours a day. Therefore, special requirements are put forward for the application performance specifications and indicators such as equipment vibration, parts and materials wear resistance, temperature and humidity resistance.
Reflow soldering is a key process in the SMT production process, which directly affects electronic products. Therefore, the reflow soldering process must be strictly controlled. When setting and adjusting the reflow welding process parameters, it is necessary to understand the effect of various process parameters of reflow welding on the reflow welding temperature curve.
2. SMT patch welding standard inspection of three major pieces (sufficient): online 3D-SPI solder paste inspection machine AOI automatic optical detector<furnace front AOI inspection (leakage, deviation) AOI furnace rear AOI inspection>X-ray detector nearest SMT first article detector
3. Logistics automation around SMT (sufficient):
Fully automatic loading and unloading aims to reduce manual participation and ensure the consistency and stability of quality.
1. Cooperate with production automation: loading machine, connecting machine, AGV, special for lower plate machine, equal transfer machine, full-automatic corner machine, vacuum plate suction machine, automatic screw locking machine
2. Cooperate with detection automation: special docking station PCB storage buffer full-automatic PCB turnover machine
Special AGV unmanned trolley:
With the development of computer artificial intelligence, image processing technology and other fields, using computer vision technology to guide has become an important means of AGV navigation, and has become a research hotspot in recent years. This method obtains road image information through camera and processes it to obtain road parameters, so as to guide AGV navigation.
Application field:
1. SMT production line and workshop material supply system to save manpower for customers to the greatest extent
2. SMT logistics automation is based on PCBA transit carrier (intelligent shelf or material rack), special AGV unmanned handling trolley, intelligent access terminal, handling robot, material switch, etc
3. Reduce the floor area of equipment
In the SMT mounting process, the materials shall be inspected first to check whether the amount, specification, model, quality and performance of the materials meet the requirements; Then brush the solder paste. The solder paste needs to be defrosted and mixed evenly. Adjust the steel mesh, print the solder paste, and check that the paste surface is even and aligned; Then use the placement machine for the placement process, and pay attention to the location, model, direction, polarity and tidiness; In order to ensure the quality of PCB board, the new product inspector must check the surface of PCB board according to the high standard of no wrong parts, wrong poles, missing parts and misplacement. The solder paste must be attached evenly, and the components must be level and aligned; Secondly, reflow the qualified PCB and conduct 250 deg; High temperature solidification is also known as reflow soldering. After the SMT is completed, AOI image detection should be carried out to avoid wrong materials, mixed materials and false soldering in the SMT.
The PCB board shall be handled gently, and the temperature, speed regulation, board placement and board connection shall be carried out; The second is to check the tin surface, maintain the machine, and check the tin surface to avoid tin connection, tin build-up, less tin, faulty soldering, oblique soldering, desoldering, error repair and leakage repair.