3D solder paste thickness gauge HS 60 online (imported from PARMI, South Korea) Skills:

Detection principle: laser laser detection Solder paste configuration: all solder pastes/tin or Wuxi detection Substrate configuration: all colors&all pads Offline programming: Gerberworks SPC&

Project monitoring: SPCworks

System diagnosis: SPImanager

Measurement: Camera system: High frame rate C-MOS sensor, 18X18 μ m pixel resolution

Scanning resolution: 20 μ M Side resolution: 18 μ M height resolution: 0.2 μ M Maximum solder paste height: 1000 μ m

Maximum solder paste size: 20X20mm Minimum solder paste size: 200X200 μ M Minimum Solder Paste Pitch: 150 μ m

Inspection performance: inspection type Height, area, volume, offset, bridge connection detection speed: the highest precision (30sq. cm/sec) The fastest speed (60 sq. cm/sec) In and out time: 1 sec