KY8030-2 molar technology is adopted to solve the problem of detection precision caused by plate bending in real time and provide high reliability detection capability
Option function of automatic tin replenishment
Perfect compensation for unprinted solder paste through the high-precision and convenient automatic tin filling function
Timely solve the problem of solder paste not being printed in the printing process, minimize the overall maintenance cost of SMT project, and improve the pass through rate.
Product characteristics
3D solder paste detection (two-way lighting)
High speed and efficient production line optimization 3D SPI
Using dual lighting to solve the shadow problem
To ensure the printing process of quick cases, Easy UI and SPC Plus programs are basically equipped
M. L, XL models and Dual Lane systems are available.
Technical parameters:
Base plate size: 70 * 70-330 * 250mm
Base plate thickness: 0.4-4mm
Equipment size: 820 * 880 * 1400mm
Equipment weight: 550kg
FOV size: 32 * 24mm
Measurement accuracy:± 2um
Power supply requirements: single-phase (s) 200-240v 15AMPS, 60Hz unidirectional
Product introduction:
The most precise and stable detection function KY-8030-2
3x faster
Bar code that can identify multiple panels
It has the automatic compensation capability when PCB is turned off
Accurately measure the area of printing solder paste to calculate the solder paste volume
Gao Yongli Completely Solves the Shadow Problem with Double Light Sources
Any program can be edited in 10 minutes
Unique SPI technology utilizing 2D 3D technology