? Adopt KY8030-2 molar technology to solve the problem of detection precision caused by plate bending in real time and provide high reliability detection capability

? Option function of automatic tin replenishment

? Perfect compensation for the unprinted solder paste through the high-precision and convenient automatic tin filling function

? Timely solve the problem of solder paste not being printed during printing, minimize the overall maintenance cost of SMT project, and improve the pass through rate.