◆ Monorail high-speed 3D solder paste detection system
◆ PSLM PMP programmable phase profile modulation measurement technology

◆ Test items: volume, area, height, XY offset, shape
◆ Type of defects detected: missed printing, more tin, less tin, connected tin, offset, poor shape
◆ Small detection element: 01005 (British system)
◆ XY positioning accuracy: 1um Grading ruler
◆ Repeatability precision: height<1um (4sigma); Area/volume<<1% (4sigma)
◆ 460x460mm detection area
◆ High precision industrial camera with ultra-high frames
◆ Detection speed: 0.3 s/FOV
◆ Mark point identification: 0.5 s/piece
◆ Large detection height:/- 550um (/- 1200um is an option)
◆ RGB Tune patented technology
◆ D-Lighting patented technology
◆ Dynamic profiling function and static anti warping function
◆ Barcode recognition function with three-point photo taking function
◆ Full closed loop control function of printing machine
◆ Chip mounter Badmark transmission function
◆ Access to IMS system functions
◆ Operating system: Windows 7 Professional (64 bit)
◆ Five minute programming, one key operation
◆ SPC process control
       

Product Family Series S8080

Technical parameters
Product Description: Cost Effective Model

Measurement Principle: 3D white light PSLM PMP Programmable Spatial Light Modulation, commonly known as moire fringe technology

Measurements Volume, area, height, XY offset, shape
 
Detection of Non - Performing Types Missing print, insufficient tin, excessive tin, bridging, offset, mal shapes, surface contamination

Camera Pixel 4M

Lens Types telephoto lens

Lens Resolution 20um, 18um/22um as option

FOV Size 40&times; 40mm

Accuracy XY resolution: 1um; Height: 0.37um

Repeatability height: ≤ 1um (3 Sigma); volume/acreage：<1%（3 Sigma）;

Detection repeatability Gage R&R is less than 10% (<10%)

FOV speed FOV Speed 0.45s/FOV

Quantity of Inspection Head Single Head

Red Green Blue/RGB Three Colas Option Light Source standard configuration

Benchmark Detection Time 0.5sec/Piece

Compensation Plate Bending of Real time Lift in Z-axis standard configuration

Maximum Meauring Height&plusmn; 350um

Maximum Measuring Height of PCB Warp&plusmn; 3.5mm

Minimum Pad Spacing 200um (pad height of 150um as the reference)

Smallest Measuring Size Rectangle: 200um; Round: 250um

Maximum Loading PCB Size L460xW460mm, L500mm as option

Thickness of the PCB 0.4-5mm

Height Limits of the Parts up: 30mm down: 40mm

Board Edge Distance 3mm, optional multi-functional clip edge as option
 
Fixed Orbit Setting Front orbit (back orbit as option)

PCB Transfer Direction Left to right or right to left

Orbit Width Adjustment Manual, automatic as option
 

1、 Product description 1. Programmable phase modulation profilometry (PSLM PMP): invented by Styker, its original programmable structure grating can use software to set the grating cycle; The mechanical drive and transmission parts are canceled, which greatly improves the accuracy and scope of application of the equipment, and avoids mechanical wear and maintenance costs. Realize 100% high-precision three-dimensional measurement of precision printing solder paste in SMT production line.
2. Stark synchronous structured light technology solves the shadow effect interference in the three-dimensional detection of solder paste. The combination of RG two-dimensional light source perfectly handles high contrast substrates, such as black substrates, ceramic substrates, etc. Red, blue and green light is used to provide color 2D images;
3. High resolution image processing system: an industrial CCD camera with an ultra-high frame number of 4 million pixels and a high-end lens support the rapid and stable detection of 01005 solder paste. At the same time, it provides 10um, 15um, 18um, 20um and other different detection precision to meet customers' requirements for product diversity and detection speed;
4. Fast Gerber import and programming software, which can realize fast 5-minute programming in the industry; The manual Teach function is convenient for users to program and detect when there is no Gerber data;
5. Z-axis real-time dynamic profiling: PSLM features real-time dynamic tracking of PCB warpage changes, which perfectly solves the warpage problem of flexible circuit boards and PCBs.
6. Powerful process statistics and analysis function (SPC): real-time SPC information display, complete and diverse SPC tools enable users to monitor problems in production in real time and reduce defects caused by poor solder paste printing. Provide strong quality control support for operators to make users clear at a glance;
7. Equipment repeatability accuracy<<10% (6 Sigma).

Technical parameters Product positioning: standard machine Product series: S8030 Measurement principle: 3D white light PSLM PMP

Camera pixel: 4M, 5M as option Lens type Lens Types telephoto lens, optional telecentric lens resolution: 18um, optional 20um/15um (20um/15um as option) Field size: 36 * 36mm XY resolution: 1um; Height: 0.37um Repetition accuracy: ≤ 1um (4 Sigma) Detection repeatability: far less than 10% FOV speed: 0.35s/FOV Number of detection heads: Single Head, Twin Heads as optimal) Red green blue/RGB
Three color light source: standard configuration reference point detection time: 0.5sec/Piece Z-axis real-time lifting compensation plate bending: standard configuration detection height:&plusmn; 550um (&plusmn; 1200um as option) Measurement height of bending PCB:&plusmn; 3.5mm（&plusmn;5mm as option）
Small pad spacing: 100um (the pad with a pad height of 150um is the reference. Small measurement size: rectangle: 150um; round: 200um. Large PCB carrier plate size: M size: X330 x Y250mm L size: X510 x Y505mm
PCB board thickness: 0.4-7mm Part height limit: 30mm down: 40mm Board edge distance: 3mm, optional clamping fixed rail setting: front fixed rail (rear fixed rail * option) PCB transmission direction: left to right, right to left,
Optional track width adjustment: manual, optional automatic SPC statistics: Histogram; Xbar-R Chart； Xbar-S Chart； CP&CPK；% Gage Repartability Data； SPI Daily/Weekly/Monthly Reports Gerber and CAD import: support Gerber format (274x, 274d); Manual Teach mode; CAD X/Y, Part No., Package Type, etc. Imported computer type: Dell server Computer configuration: central processor Intel 4-core memory RAM 16G (24/32G as option) image processor GPU 2G discrete graphics hard disk Hard Disk 1T DVD RW standard configuration Operating System: Windows 7 (64 bit 64 bit) Device specification: S type: 1000 x 1000 x 1525mm; 830KG L-type: 1000x1000x1525mm; 865KG power supply: 220V, 10A air pressure: 4~6Bar power: startup: 2.5kw/normal operation: 2kw ground bearing requirement: 500kg/m2
Options: edge clamping, 1D/2D Barcode scanning gun, Badmark function, printing machine closed-loop control, offline programming software, maintenance workstation, dynamic reading panel Mark point function, UPS uninterruptible power supply Styk SPI are currently on the Chinese market. Domestic solder paste detectors have large shipments, large equipment inventory (more than 1500), and high market share.

Styker s8080 s8030 s8030-2 s8030D