Specifications:

? Camera type 4 MP color camera

? Optical resolution 10µ M or 15µ m

? Imaging mode High speed dynamic imaging

? Detection speed 60 cm2/sec @ 10µ m  120 cm2/sec @ 15 µ m

? Test items

. Body defects, missing parts, erection, side erection, reverse, offset, wrong parts, reverse parts, damaged parts, etc

Solder joint defects: more tin, less tin, bridging, DIP component tin eating, IC foot warping, gold finger surface scratch and tin sticking defects

Integrated yield management system before/after furnace

. Circuit board size

. Circuit board measurable size 50 x 50 – 510 x 460 mm

. Measurable thickness of circuit board 0.6 – 5 mm

Maximum weight of circuit board 5kg