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Products

SPI solder paste thickness detector

Contact us

Shenzhen Lizhifeng Electronic Equipment Co., Ltd

Address: Floor 4, Building 2, Hengchangrong Industrial Zone, No. 128, Shajing Shangnan East Road, Bao'an District, Shenzhen

Tel.: 13925215926

Marketing hot sale: 13925286095

Email: marktong@smtlf.cn

X-RAY

X-RAY View X2000

※ The BGA faulty soldering can be easily seen through the inspection with an inclination of 60 degrees
※ Bubble inspection can visually judge the bubble volume in the BGA welding ball and whether the welding spot is qualified

Scope of application
Applicable to BCC, BGA μ Welding effect inspection of BGA, CSP and other planar array devices.

Consulting

Product details

※ 傾斜60度檢查,可輕易看清BGA虛焊不良
※ 汽泡檢查,可直觀判斷BGA焊球內汽泡體積,直觀判斷該焊點是否合格

技術參數：
空間分辨率 5um
可搭載尺寸 SMX-1000 350mm*400mm
SMX-1000L 570mm*670mm
實際檢查尺寸 SMX-1000 300mm*350mm
SMX-1000L 520mm*620mm
可搭載重量最大5kg
受光部傾斜最大60°
最高電壓 90KV（10W）
圖像檢測裝置平板檢測器（FPD）
檢查視野約2～35mm
放大倍率約6～158倍（動畫最大為127倍）
輸入電壓 AC100V 1KVA
設備尺寸 SMX-1000 995mm*990mm*1285mm
SMX-1000L 1490mm*1525mm*1325mm
設備重量 SMX-1000 約500kg
SMX-1000L 約950kg
應用范圍
適用于SMT生產過程中BCC、BGA、μBGA、CSP等面陣列器件的焊接效果檢查。