New KOHYOUNG KY8080L 3D SPI Solder Paste Thickness Tester

Brand: Koh Young

Origin: South Korea

Model: KY8080 (M Size)

Base plate size (monorail): 50x50~350x330mm

Base plate size (double track): 50x50~350x580mm single track mode 50x50~350x320mm double track mode

Height limit of base plate: 3mm above and 3.5mm below

Resolution: 1.0um/pulse

Precision: 20um

Power supply: 200-240VAC, 50/60Hz single-phase

Air source: 5kgf/cm2 (0.45MPa), 2Nl/min (0.08cfm)

Equipment size: 800x1335x1627mm

Weight: single rail 600kg, double rail 650kg

Model: KY8080 (L Size)

Base plate size (monorail): 50x50~510x510mm

Base plate size (double track): 50x50~510x580mm single track mode 50x50~510x320mm double track mode

Height limit of base plate: 3mm above and 3.5mm below

Resolution: 1.0um/pulse

Precision: 20um

Power supply: 200-240VAC, 50/60Hz single-phase

Air source: 5kgf/cm2 (0.45MPa), 2Nl/min (0.08cfm)

Equipment size: 1000x1335x1627mm

Weight: single rail 600kg, double rail 650kg

Koh Young KY8080 3D SPIFeatures of solder paste detector:

3D detection can solve the problem of light source shadow

Achieve fast detection in the industry while maintaining high accuracy

Easy to operate

Powerful SPC statistical management

The bent PCB affects the reliability of the detection value, so it is processed by 3D compensation.