Model: TR7007 SII

Origin: Taiwan

Brand: Deyue

Product: SPI solder paste thickness detector

Price: Negotiable (rent and sell, price concessions)

The TR7007 SII is an industrial fast solder paste printing detector with a detection speed of up to 200 cm2/sec. High precision online shadowless solder paste printing detection solution provides full 3D detection with a resolution of 15 μ m or 10 μ M and has a high-precision linear motor platform.

The features of this system include closed loop function, enhanced 2D imaging technology, automatic bending compensation function and streak light scanning technology. This series also has a dual track model, which greatly improves the production line capacity without increasing the landing space of the machine.
 

characteristic:
Industry fast solder paste printing detector
Shadow free fringe light detection technology
Optical resolution provided 10 μ M and 15 μ M Two options
X-Y table linear motor can provide accurate vibration free detection

Specifications:
Camera 4 MP camera
Optical resolution 10 μ M or 15 μ M (optional, set at the factory)
Detection speed 10 μ Up to 90 cm2/sec 15 at m resolution μ Speed up to 200 cm2/sec at m resolution

High reproducibility 0.4 μ m
Minimum measurable tin point spacing 100 μ m
Measurable size of circuit board (other models of DELHI SPI)
TR7007M SII   50 x 50 – 350 x 350 mm
TR7007 SII   50 x 50 – 510 x 460 mm
TR7007L SII    50 x 50 – 660 x 610 mm
TR7007LL SII   50 x 50 – 850 x 610 mm
TR7007 SII DUALLANE   50 x 50 – 510 x 310 m

TR7007 SII 3D SPI

With outstanding detection performance and simple programming, SPI high-precision shadow free detection solution brings maximum value to your production line.

New optimized and humanized user interface

The five steps are easily organized to minimize the workload of operators and maximize the SPI performance.

Closed Loop Function

TRI SPI detection system can share the detection results with the connected production equipment to improve the output and stabilize the production quality.

accuracy

High reproducibility

? Calibration standard (at 3 σ) < 1% on TRI certification target

? Tin point GR&R (&plusmn; 50% Tolerance)<<10% at 6 σ

speed

? 10 μ M up to 90 cm2/sec

? 15 μ M up to 200 cm2/sec

Use dynamic image technology and color LED light source to obtain positioning points

Shadow problem: effectively solve the problem of shadow and irregular reflection

The dual direction light source lighting system is adopted in combination with the cross reference bilateral data technology to solve the problem of irregular reflection of shadows at the same time.

Production line system integration scheme

TRI's defect management system can link the inspection data in SPI, AOI and AXI systems to track the root cause of defects through the entire assembly circuit board production line. With modular architecture, it can provide centralized detection management, real-time defect monitoring and analysis, and usual knowledge management to find problems and implement solutions to maximize production yield.