Automatic 3D detection, clear image

Tomography Synthesis Technology
Easy maintenance and operation
Fast program setup and device installation
American [YESTEch] Company is a famous X-RAY
And AOI testing equipment manufacturers to provide SMT industry, semiconductor packaging industry with improved quality products
A practical and effective solution. He joined Nordson Group in 2007.

YESTech powerful X3 automatic X-ray detection equipment

(AXI) helps users detect solder joints and other invisible defects, which can be applied to electronic assembly, PCB and semiconductor packaging industries. Whether used online or offline, the detection algorithm of X series equipment can quickly and stably perform automatic detection and feed back important information in the production process in real time.

YTX-X3 programming is fast and simple. Generally, users can create a complete detection program in 60 minutes. The use of standard components can simplify the programming process, and ensure that the same detection program can be used in different production lines. The newly adopted image processing process integrates a variety of technologies and detection algorithms, which can help users greatly reduce the error rate in the defect detection process and improve the efficiency of equipment use.

Performance Parameters of YTX-X3 3D AXI Testing Equipment

X-ray tube:

Software:
Maintenance free, sealed X-ray tube

100KV, focus size 5 microns
-High output power 20W

 
 
CAD input

CAD conversion compatible software:

Operating system:

Offline software:

SPC software (optional):

Detection capability:
CAD X-Y data, patch data import

Excel,Circuitcam,Unicam

Windows  XP

Offline software: OLS (offline programming, defect review),

Real time SPC output report, first pass rate, defect classification, remote control

 
 

Equipment:
0.5 square inch/second

450mx508mm(18x20in)

50mm above and below the base plate

01005

Devices: location, missing parts, deformation, stele erection

Device pins: bending, faulty soldering, bridging, tilting

Soldering: open circuit, lack of tin, short circuit, solder ball

BGA: short circuit, cavity, position, faulty soldering, solder ball

 
 
Equipment power supply:

Air pressure input:

Equipment size:

Equipment weight:
220VAC，50Hz，15A

80 PSI

1500mmx1664mmx1600mm(59wx66d*63h in.)

5000 lbs (2273 kg)
 
Safety information:
The manufacturing and production of YESTech's X-ray testing equipment is completely in accordance with the provisions of Article 21, Chapter J of the Administrative Regulation 1020.40 of the United States Federal Standard I on Similar X-ray Equipment. A lead strip seal is used between the chassis and the observation window door, and the observation window is made of leaded glass. The interlock mechanism of the equipment can ensure that there is no X-ray leakage when any part of the machine is opened or removed.

When YTX-X3 AXI is used in combination with AOI equipment, AXI will greatly improve defect coverage and can detect defects in almost all process flows. The offline programming function and the use of SPC software can provide users with a solution to enhance productivity.