1. SPI HS60 Series is the best-selling model of PARMI, which has been installed in good SMT production sites around the world, and its stability of performance has been affirmed. Dual Laser is used to overcome the shadow problem, and the triangulation method is used to measure the RSC of the rare 3D technology MPC (Multiple profile correlation) of PARMI_ 5 The sensor can present a real 3D image that is close to the actual shape. In addition, the Real Time Z-Axis Tracking function is used consistently to provide the detection capability of substrate bending.

2. SPI HS60 has a solid hardware structure. Considering that the design of the maintenance surface has almost zero failure rate, even in the event of a machine failure, spare parts can be easily and quickly replaced. It has the advantages of reducing costs and saving time on the maintenance surface. In particular, the X axis of Scan uses a linear servo motor, which makes its axis travel more smooth and stable. This is also an important basis for RSC Sensor to obtain high-quality 3D data, The user interface is designed to be intuitive and convenient, through which multiple data and software applications can be observed directly and quickly. The big advantage is that users can easily get started. They can use SPC, RMC, Screen Printer Feedback.. And other software to improve and optimize their production lines more efficiently and expand their production capacity

PARMI solder paste detector SPI HS60 Product specification: 390x260mm