Product characteristics:

Original use of DISP (dynamic picture seamless splicing technology)

It refreshes the traditional mode in the industry and realizes the dynamic seamless splicing of multiple images of the whole board for the first time.

The real-time display of PCB whole board image has become a reality, which facilitates and simplifies program making and defect alarm confirmation.

GPU parallel computing technology is used to replace traditional CPU computing mode for the first time

It filled the gap in the industry, and applied GPU parallel computing to the field of machine vision for the first time, greatly reducing the image processing time.

It makes it possible to match the whole board image template. Therefore, it can be used to assist in detecting multiple pieces and tin beads at any position on the PCB.

Advanced application of VISTA platform and its core technology - DX10 features

The system software has successfully realized a simple and intuitive VISTA style interface and a fast operation mode.

Thanks to the intuitive and broad system software, the programming method has been greatly simplified, and has become no longer cumbersome and difficult.

Take the lead in enabling the perfect combination of ultra-high resolution image acquisition system and high-precision mechanical transmission system

It ensures the accurate and stable detection capability of 01005 micro chip components and 0.3mm close pin pitch ICs.

The detection efficiency and repeatability of the product are fully guaranteed.

Test items:

After the reflow furnace, after the wave soldering furnace: missing parts, multiple parts, solder balls, offset, side standing, stele standing, reverse pasting, reverse polarity, wrong parts, bad parts, bridging faulty soldering, wrong identification, no soldering, less tin, more tin, component floating, IC pin floating, IC pin bending, no pin, etc

Before reflow furnace: missing parts, multiple parts, offset, side standing, reverse pasting, reverse polarity, wrong parts, broken parts, bridging, etc

After solder paste printing: Wuxi paste, less solder paste, offset, bridging, foreign matters, etc

Specifications:

Product model: Heli LI-520XL

Applicable process of PCB board: after reflow furnace/after wave soldering furnace, before reflow furnace, after solder paste printing (both lead and lead-free are applicable)

PCB board size: 50 * 50mm-520 * 480mm

PCB board thickness: 0.3mm-4mm

PCB board bending:/- 3mm (standard thimble should be bent)

PCB board upper and lower clear height; Above: ≤ 40mm Below: ≤ 40mm

Camera system: color digital camera

Lighting system: LED lighting (coaxial vertical multi angle oblique lighting)

Resolution: 13/16/19um

Detection methods: color operation, color extraction, grayscale extraction, grayscale operation, image comparison, whole board matching, character discrimination, etc

mechanical system

X/Y drive system: AC servo motor precision ball screw linear guide resolution: 1UM, positioning accuracy: 8UM

Moving speed: 830mm/s (Max)

Track width adjustment: automatic

Rail conveyor belt: anti-static flat belt

Rail transmission height: 900m, adjustable up and down (870mm-970mm)

Track communication flow direction: left in and right out, right in and left out, left in and left out, right in and right out (customized before delivery)

software system

Operating system: Windows7 Professional 64 bit

Interface language: Chinese and English optional interface

Test result output: base plate ID, base plate name, component name, defect name, defect image, whole plate image, etc

Optional parts: maintenance station system, offline programming system, SPC server system, barcode identification system, etc

Power supply specification: AC220V± 10%, 50/60HZ, 1.5KW (maximum power consumption)

Pressure specification: 0.5 MPa

Communication interface: standard SMEMA

. Ambient temperature: 10to40° C

Ambient humidity: 10to80% RH (no frost)

Product weight: 850KG

Boundary dimension: 1100 * 1133 * 1595MM