KY-8030 online solder paste thickness gauge.
Online/inline
PMP (grating phase shift profilometry) high-performance RGB linear CCD,
Combined with three-phase displacement imaging technology (Moore fringe)
White LED White LED
3 x 1
whether
GPU based PMP acceleration algorithm,
Industry - SPI devices using this technology have faster CPU based PMP algorithm than other CPU based computing methods
3 sets of annular LEDs, white, red and blue
True color mode, black and white mode, black and white mode
4 megapixel industrial camera
62 frame image acquisition rate RGB Tri linear CCD,
42mm scan line width
2352 x 1728,
18um 64 cm2/sec
42.3 x 31.1 mm (pixel size: 18um) 42mm line width, (pixel size: 20um)
0~550um 50~450um
0.36um 1.225um
/- 1um
(Based on actual solder paste/correction block)/- 4um
(Based on actual solder paste)
Volume, area, height, XY position, shape, etc. Volume, area, height, XY position, shape, etc
More/less tin, missing print, solder paste tip, bridging, offset, profiled, dirty, etc. More/less tin, missing print, solder paste tip, bridging, offset, profiled, dirty, etc
<1% @ 3sigma Volume<3% @ 3sigma, height 3um@3sigma
<10% <10%
have
Real time automatic profiling motion compensation No bending of each PCB